Ball mount flux for wafer with UBM plating

 

Background
When solder balls were cleaned after mounting with the current flux, the flux residue was not fully cleaned, resulting in poor cleaning.
Solution
In developing the flux, we added additives that are compatible with our cleaning agent "Pine Alpha" to be designed in the composition that makes it easy to clean flux residue.
Effectiveness
In the cleaning after solder ball soldering, almost no flux residue left.
Product
WHP-150R3
     After cleaning soldered with current flux         with WHP-150R3





( Images are for illustrative purposes only. )