- Background
- When solder balls were mounted on Ni-Pd-Au plated rigid boards with the current flux, missing balls are frequently detected where solder balls were not properly mounted in the designated place.
- Solution
- In developing the flux, the physical properties of the flux were appropriately adjusted to ensure that a sufficient amount of flux was available at printing.
- Effectiveness
- Stable and sufficient quantities of flux can be provided which required for printing and significantly avoided missing balls.
- Product
- WHP-123
- Soldered with current fulx with WHP-123
( Images are for illustrative purposes only. )