- Background
- When solder balls were mounted with the current flux, wrinkling and other wetting defects occurred on the solder ball surface. There were concerns about ball height variation and poor junction.
- Solution
- In developing the flux, we formulated a sufficient amount of components that would stay on the ball surface in order to prevent the flux flowing off the solder balls surface during reflow.
- Effectiveness
- The flux stayed on the ball surface during reflow process, which improved wrinkling and other wetting defects.
- Product
- WHP-121
- Solder ball surface with current flux with WHP-121
( Images are for illustrative purposes only. )